 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| TA8266HQ TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA8266HQ Max Power 35 W BTL x 4 ch Audio Power IC The TA8266HQ is 4 ch BTL audio power amplifier for car audio application. This IC can generate more high power: POUTMAX = 35 W as it is included the pure complementary PNP and NPN transistor output stage. It is designed low distortion ratio for 4 ch BTL audio power amplifier, built-in stand-by function, muting function, and diagnosis circuit which can detect output to VCC/GND short and over voltage input mode. Additionally, the AUX amplifier and various kind of protector for car audio use is built-in. Weight: 7.7 g (typ.) Features * High power : POUTMAX (1) = 35 W (typ.) (VCC = 14.4 V, f = 1 kHz, JEITA max, RL = 4 ) : POUTMAX (2) = 31 W (typ.) (VCC = 13.7 V, f = 1 kHz, JEITA max, RL = 4 ) : POUT (1) = 23 W (typ.) (VCC = 14.4 V, f = 1 kHz, THD = 10%, RL = 4 ) : POUT (2) = 20 W (typ.) (VCC = 13.2 V, f = 1 kHz, THD = 10%, RL = 4 ) * * * * www..net Built-in diagnosis circuit (pin 25) Low distortion ratio: THD = 0.02% (typ.) (VCC = 13.2 V, f = 1 kHz, POUT = 5 W, RL = 4 ) Low noise: VNO = 0.18 mVrms (typ.) (VCC = 13.2 V, Rg = 0 , GV = 34dB, BW = 20 Hz~20 kHz) Built-in stand-by switch function (pin 4) Built-in muting function (pin 22) Built-in AUX amplifier from single input to 2 channels output (pin 16) Built-in various protection circuit : Thermal shut down, over voltage, out to GND, out to VCC, out to out short, speaker burned Operating supply voltage: VCC (opr) = 9~18 V * * * * Note 1: Install the product correctly. Otherwise, it may result in break down, damage and/or degradation to the product or equipment. Note 2: These protection functions are intended to avoid some output short circuits or other abnormal conditions temporarily. These protect functions do not warrant to prevent the IC from being damaged. - In case of the product would be operated with exceeded guaranteed operating ranges, these protection features may not operate and some output short circuits may result in the IC being damaged. 1 2006-04-28 TA8266HQ Block Diagram C5 1 TAB 20 VCC1 6 VCC2 OUT1 (+) 9 C1 11 IN1 PW-GND1 8 OUT1 (-) 7 RL OUT2 (+) 12 IN2 5 RL C1 PW-GND2 2 OUT2 (-) 3 C6 16 AUX IN OUT3 (+) 15 IN3 17 RL C1 PW-GND3 18 OUT3 (-) 19 OUT4 (+) 14 IN4 21 RL C1 PW-GND4 24 OUT4 (-) 23 PRE-GND 13 RIP 10 C2 STBY 4 DIAGNOSIS OUT MUTE 25 22 R1 C4 www..net : PRE-GND : PW-GND Note3: Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purpose. C3 2 2006-04-28 TA8266HQ Caution and Application Method (Description is made only on the single channel.) 1. Voltage Gain Adjustment This IC has no NF (negative feedback) terminals. Therefore, the voltage gain can't adjusted, but it makes the device a space and total costs saver. Amp. 2A Amp. 1 Input Amp. 2B Figure 1 Block Diagram The voltage gain of Amp.1 : GV1 = 8dB The voltage gain of Amp.2A, B : GV2 = 20dB The voltage gain of BLT Connection : GV (BTL) = 6dB Therefore, the total voltage gain is decided by expression below. GV = GV1 + GV2 + GV (BTL) = 8 + 20 + 6 = 34dB 2. Stand-by SW Function (pin 4) By means of controlling pin 4 (stand-by terminal) to high and low, the power supply can be set to ON and OFF. The threshold voltage of pin 4 is set at about 3VBE (typ.), and the power supply current is about 2 A (typ.) at the stand-by state. VCC ON Power OFF 4 10 k 2VBE to BIAS CUTTING CIRCUIT Control Voltage of pin 4: VSB Stand-by www..net Power OFF ON VSB (V) 0~1.5 3~VCC ON OFF Figure 2 With pin 4 set to High, Power is turned ON Adjustage of Stand-by SW (1) (2) Since VCC can directly be controlled to ON or OFF by the microcomputer, the switching relay can be omitted. Since the control current is microscopic, the switching relay of small current capacity is satisfactory for switching 3 2006-04-28 TA8266HQ Large current capacity switch BATTERY RELAY BATTERY VCC VCC - Conventional Method - FROM MICROCOMPUTER Small current capacity switch BATTERY DIRECTLY FROM MICROCOMPUTER BATTERY Stand-By VCC Stand-By VCC - Stand-by Switch Method - Figure 3 3. Muting Function (pin 22) By means of controlling pin 22 less than 0.5 V, it can make the audio muting condition. The muting time constant is decided by R1 and C4 and these parts is related the pop noise at power ON/OFF. The series resistance; R1 must be set up less than 10 k to get enough muting attenuation. The muting function have to be controlled by a transistor, FET and micro-controller port which has IMUTE > 250 A ability. Pin 22 terminal voltage has the temperature characteristics of 4.6 V (low temperature) to 3.2 V (high temperature). Therefore, it is need to design with attention as using the micro-controller of which operating voltage is less than 5 V. Terminal 22 may not be pulled up and shall be controlled by OPEN/LOW. When it is obliged to do, it must be pulled up via diode, because it has to defend flowing reverse current to internal circuit of pin 22. www..net ATT - VMUTE 20 I (100 A) IMUTE (OFF) 22 C4 R1 A (dB) 10 k 0 -20 -40 -60 -80 -100 0 0.4 0.8 1 1.2 1.6 2 5 k IMUTE VMUTE Mute attenuation ATT I (100 A) IMUTE (OFF) 22 C4 R1 IMUTE VMUTE VCC = 13.2 V Po = 10 W PL = 4 f = 1 kHz 2.4 2.8 3 Point A voltage: VMUTE (V) Figure 4 Muting Function Figure 5 Mute Attenuation - VMUTE (V) 4 2006-04-28 TA8266HQ 4. AUX Input (pin 16) The pin 16 is for input terminal of AUX amplifier. The total gain is 0dB by using of AUX amplifier. Therefore, the -COM can directly drive the AUX amplifier. BEEP sound or voice synthesizer signal can be input to pin 16 directly. When AUX function is not used, this pin must be connected to PRE-GND (pin 13) via a capacitor. 20dB AMP. IN OUT (+) OUT (-) AUX AMP -COM AUX-IN 16 -20dB Figure 6 5. AUX Input Diagnosis Output (pin 25) This diagnosis output terminal of pin 25 has open collector output structure on chip as shown in Figure 7. In case diagnosis circuit that detect unusual case is operated, NPN transistor (Q1) is turned on. It is possible to protect all the system of apparatus as well as power IC protection. In case of being unused this function, use this IC as open-connection on pin 25. 5V 25 5V OUTPUT SHORT PROTECTOR OVER VOLTAGE PROTECTOR Q1 GND t Q1 is turned on pin 25: Open collector output (active low) Figure 7 Self Diagnosis Output www..net 5.1 In Case of Shorting Output to VCC/GND or Over Voltage Power Supplied NPN transistor (Q1) is turned on. Threshold of over voltage protection: VCC = 22 V (typ.) 5V -COM LED/LCD ALARM (Flashing) (Announcement from a speaker.) (Relay OFF) 25 REGULATOR OFF MEMORY (Count and record) Figure 8 5.2 Application 1 In Case of Shorting Output to Output NPN transistor (Q1) is turned on and off in response to the input signal voltage. 5 2006-04-28 TA8266HQ 6. Prevention of speaker burning accident (In Case of Rare Short Circuit of Speaker) When the direct current resistance between OUT + and OUT - terminal becomes 1 or less and output current over 4 A flows, this IC makes a protection circuit operate and suppresses the current into a speaker. This system makes the burning accident of the speaker prevent as below mechanism. Current into a speaker Operating point of protector Less than 4 About 1 4 Speaker impedance Figure 9 Note 4: It is appeared by biased input DC voltage (for example, large leakage of the input capacitor, short-circuit between copper patterns of PCB.) www..net 6 2006-04-28 TA8266HQ 6.1 Applications When output terminals short-circuit to VCC or GND, the voltage of 25pin is fixed to "L". And when shorting OUT + to OUT -, "L" and "H" are switched according to an input signal. Therefore, it is possible to judge how the power IC condition is if a micro-controller detects the 25pin voltage that is smoothed out with LPF. It is recommend that the threshold voltage (Vth) is set up as higher as possible because output level of LPF is changed according to an input signal. (for example, Vth is set up to 4 V if 25pin is pulled up to 5 V line.) Output voltage of L.P.F. Operating point of protector 5V Output power Figure 10 www..net 7 2006-04-28 TA8266HQ Absolute Maximum Ratings (Ta = 25C) Characteristics Peak supply voltage (0.2 s) DC supply voltage Operation supply voltage Output current (peak) Power dissipation Operation temperature Storage temperature Symbol VCC (surge) VCC (DC) VCC (opr) IO (peak) PD (Note5) Topr Tstg Rating 50 25 18 9 125 -40~85 -55~150 Unit V V V A W C C Note5: Package thermal resistance j-T = 1C/W (typ.) (Ta = 25C, with infinite heat sink) The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not be exceeded during operation, even for an instant. If any of these rating would be exceeded during operation, the device electrical characteristics may be irreparably altered and the reliability and lifetime of the device can no longer be guaranteed. Moreover, these operations with exceeded ratings may cause break down, damage and/or degradation to any other equipment. Applications using the device should be designed such that each absolute maximum rating will never be exceeded in any operating conditions. Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this documents. Electrical Characteristics Characteristics Quiescent current (unless otherwise specified VCC = 13.2 V, f = 1 kHz, RL = 4 , Ta = 25C) Symbol ICCQ POUT MAX (1) Output power POUT MAX (2) POUT (1) POUT (2) Total harmonic distortion Voltage gain Voltage gain ratio Output noise voltage THD GV GV VNO (1) VNO (2) Ripple rejection ratio Cross talk Output offset voltage Input resistance Stand-by current Stand-by control voltage R.R. C.T. VOFFSET RIN ISB VSB H VSB L Mute control voltage (Note6) VM H VM L Mute attenuation ATT M Test Circuit VIN = 0 VCC = 14.4 V, max Power VCC = 13.7 V, max Power VCC = 14.4 V, THD = 10% THD = 10% POUT = 5 W VOUT = 0.775 Vrms (0dBm) VOUT = 0.775 Vrms (0dBm) Rg = 0 , DIN45405 Rg = 0 , BW = 20 Hz~20 kHz frip = 100 Hz, Rg = 620 Vrip = 0.775 Vrms (0dBm) Rg = 620 VOUT = 0.775 Vrms (0dBm) Stand-by condition Power: ON Power: OFF Mute: OFF Mute: ON, R1 = 10 k Mute: ON, VOUT = 7.75 Vrms (20dBm) at Mute: OFF. 0 80 Test Condition Min 17 32 -1.0 40 -150 3.0 0 Typ. 200 35 31 23 20 0.02 34 0 0.20 0.18 50 60 0 30 2 Open 90 0.5 Max 400 0.2 36 dB 1.0 0.42 +150 10 VCC 1.5 V dB dB dB mV k A V mVrms % W Unit mA www..net Note6: Muting function have to be controlled by open and low logic, which logic is a transistor, FET and -COM port of IMUTE > 250 A ability.This means than the mute control terminal : pin 22 must not be pulled-up. 8 2006-04-28 TA8266HQ Test Circuit 1 TAB 20 VCC1 6 VCC2 OUT1 (+) 9 0.22 F C1 11 IN1 PW-GND1 8 OUT1 (-) 7 RL OUT2 (+) 0.22 F C1 12 IN2 5 RL PW-GND2 2 OUT2 (-) 3 0.22 F C6 16 AUX IN OUT3 (+) 0.22 F C1 15 IN3 17 RL PW-GND3 18 OUT3 (-) 19 OUT4 (+) 0.22 F C1 14 IN4 21 RL PW-GND4 24 OUT4 (-) 23 PRE-GND 13 RIP STBY 4 DIAGNOSIS OUT MUTE 25 22 10 k R1 C4 1 F www..net 10 10 F C2 3900 F : PRE-GND : PW-GND C3 0.1 F C5 9 2006-04-28 TA8266HQ T.H.D - POUT 100 VCC = 13.2 V RL = 4 100 f = 1 kHz RL = 4 T.H.D - POUT (%) 10 (%) Total harmonic distortion T.H.D 10 Total harmonic distortion T.H.D 1 10 kHz 1 100 Hz 0.1 1 kHz 9.0 V 0.1 13.2 V 16.0 V 0.01 0.1 1 10 100 0.01 0.1 1 10 100 Output power POUT (W) Output power POUT (W) ICCQ - VCC 400 1 T.H.D - f (%) T.H.D 0.1 RL = (mA) VIN = 0 300 ICCQ OUT3 200 Total harmonic distortion Quiescent current OUT2, 3 OUT4 0.01 100 www..net VCC = 13.2 V RL = 4 Pout = 5 W 0.001 10 100 1k 10 k 100 k 0 0 10 20 30 Power supply voltage VCC (V) Frequency f (Hz) 10 2006-04-28 TA8266HQ VNO - Rg 300 0 VCC = 13.2 V -10 -20 -30 -40 -50 -60 -70 10 RL = 4 Rg = 620 Vrip = 0dBm R.R. - f (Vrms) VNO 200 Output noise voltage 150 100 50 0 10 100 1k 10 k Ripple rejection ratio R.R. (dB) VCC = 13.2 V RL = 4 250 BW = 20 Hz~20 kHz 100 k 100 1k 10 k 100 k Singnal source resistance Rg () Frequency f (Hz) C.T. - f (OUT1) 0 VCC = 13.2 V -10 RL = 4 VOUT = 0dBm -10 0 VCC = 13.2 V RL = 4 VOUT = 0dBm Rg = 620 C.T. - f (OUT2) (dB) -20 -30 -40 -50 (dB) C.T. Cross talk OUT1 OUT2, 3, 4 Rg = 620 -20 -30 -40 -50 Cross talk C.T. OUT2 OUT1, 3, 4 -60 -70 10 -60 -70 10 100 1k 10 k 100 k 100 1k 10 k 100 k Frequency f (Hz) Frequency f (Hz) www..net C.T. - f (OUT3) 0 VCC = 13.2 V -10 RL = 4 VOUT = 0dBm -10 0 VCC = 13.2 V RL = 4 VOUT = 0dBm Rg = 620 C.T. - f (OUT4) (dB) -20 -30 -40 -50 -60 -70 10 (dB) C.T. Cross talk OUT3 OUT4 OUT3 OUT1, 2 Rg = 620 -20 -30 -40 -50 -60 -70 10 Cross talk C.T. OUT4 OUT1, 2, 3 100 1k 10 k 100 k 100 1k 10 k 100 k Frequency f (Hz) Frequency f (Hz) 11 2006-04-28 TA8266HQ GV - f 40 35 70 60 PD - POUT (dB) 30 25 20 15 10 5 0 10 PD (W) 50 40 13.2 V 30 20 9V 10 0 16 V GV VCC = 13.2 V RL = 4 VOUT = 0dBm 100 1k 10 k 100 k Power dissipation Voltage gain f = 1 kHz RL = 4 0 5 10 15 20 25 Frequency f (Hz) Output power POUT/ch (C) PD MAX -Ta 120 (W) INFINITE HEAT SINK RJC = 1C/W HEAT SINK (RHS = 3.5C/W) RJC + RHS = 4.5C/W NO HEAT SINK RJA = 39C/W PD MAX Allowable power dissipation 100 80 60 40 20 0 0 25 50 75 100 125 150 Ambient temperature Ta (C) www..net 12 2006-04-28 TA8266HQ Package Dimensions Weight: 7.7 g (typ.) www..net 13 2006-04-28 TA8266HQ www..net 14 2006-04-28 TA8266HQ * Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. * If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. For details on how to connect a protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition. * Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. * Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. * Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. * Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. * Heat Radiation Design When using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. * Installation to Heat Sink Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC chip. In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink installation, refer to individual technical datasheets or IC databooks. www..net 15 2006-04-28 TA8266HQ RESTRICTIONS ON PRODUCT USE * The information contained herein is subject to change without notice. 021023_D * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C * The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E * This product generates heat during normal operation. However, substandard performance or malfunction may cause the product and its peripherals to reach abnormally high temperatures. The product is often the final stage (the external output stage) of a circuit. Substandard performance or malfunction of the destination device to which the circuit supplies output may cause damage to the circuit or to the product. 030619_R www..net 060116EBF About solderability, following conditions were confirmed * Solderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux 16 2006-04-28 |
Price & Availability of TA8266HQ
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |